We are looking for a highly strategic and accomplished Team Lead of ATE Test & Product to provide executive leadership and oversight for the entire product lifecycle from silicon validation through high-volume manufacturing.

This key role is responsible for driving the overall test strategy, optimizing product yields and cost, and ensuring world-class product quality across all Arbe semiconductor product lines.

Leadership & Execution

• Define and execute the long-term ATE test strategy and roadmap, ensuring alignment with R&D, operations, and business goals across all product generations.
• Lead, mentor, and develop a high-performing team, fostering a culture of innovation, collaboration, and continuous improvement.
• Work closely with cross-functional stakeholders and provide clear visibility into yield performance, test coverage, and test cost metrics.

ATE Test Engineering & Product Engineering Oversight

• Direct the ATE Test Engineering team to deliver robust, high-coverage, and cost-effective test programs for wafer probe and final test on multiple ATE platforms (e.g., Teradyne UltraFLEX, Advantest V93K, RF Testers).
• Lead the Product Engineering team in driving significant yield improvement and cost reduction initiatives (e.g., test time reduction, multi-site efficiency, limit tightening) to meet COGS targets.
• Establish and implement best practices for Design for Test (DFT) and Design for Manufacturing (DFM) in collaboration with Design Engineering.
• Oversee complex failure analysis (FA) and root cause corrective action (RCCA) processes for engineering and production yield issues.

• BSC or Master’s degree in Electrical Engineering, Computer Engineering, or a related field.
• Minimum of 10 years of experience in the semiconductor industry across ATE Test and Product Engineering.
• Minimum of 2 years of experience managing multi-disciplinary engineering teams (Test, Product, or similar functions) in a leadership position.
• Understanding of semiconductor physics, yield ramp, statistical process control (SPC).
• Proven expertise in high-volume manufacturing (HVM) yield entitlement and cost optimization.

• Experience with specific market segments (e.g., Automotive, Industrial, Data Center, RF).
• Familiarity with advanced packaging technologies and their impact on test.
• Knowledge of advanced data analytics tools for large-scale production data (e.g., Spotfire, Tableau).